Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374652 | Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Yen-Ping Wang | 2025-07-29 |
| 12362282 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2025-07-15 |
| 12322728 | Method of manufacturing die stack structure | Hsien-Wei Chen | 2025-06-03 |
| 12278199 | Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applications | Chang-Pin Huang, Tung-Liang Shao, Hsien-Ming Tu, Yu-Chia Lai | 2025-04-15 |
| 12211823 | Semiconductor package with shared barrier layer in redistribution and via and method of manufacturing the same | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh, Ying-Ju Chen | 2025-01-28 |
| 12205856 | Semiconductor structure including interconnection to probe pad with probe mark | Hsien-Wei Chen, Jie Chen | 2025-01-21 |