Issued Patents 2025
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12420891 | Release device for polar profile observation system | Hangzhou Wang, Yijie Wen, Jiajun Li, Junhao Zhu | 2025-09-23 |
| 12368115 | Supporting InFO packages to reduce warpage | Jie Chen, Hsien-Wei Chen | 2025-07-22 |
| 12362178 | Method for fabricating a chip package | Jie Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2025-07-15 |
| 12331091 | Chimeric signal peptides for protein production | Chao-Yi Teng | 2025-06-17 |
| 12334459 | Integrated circuits | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh | 2025-06-17 |
| 12327819 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2025-06-10 |
| 12288802 | Structure and method for forming integrated high density MIM capacitor | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2025-04-29 |
| 12266637 | Die stack structure and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen, Sung-Feng Yeh | 2025-04-01 |
| 12249580 | Passivation scheme design for wafer singulation | Hsien-Wei Chen, Ming-Fa Chen | 2025-03-11 |
| 12218097 | Bonding to alignment marks with dummy alignment marks | Hsien-Wei Chen, Ming-Fa Chen | 2025-02-04 |
| 12211823 | Semiconductor package with shared barrier layer in redistribution and via and method of manufacturing the same | Hsien-Wei Chen, Ching-Jung Yang, Ming-Fa Chen, Sung-Feng Yeh | 2025-01-28 |
| 12211707 | Integrated circuit package and method of forming thereof | Hsien-Wei Chen, Ming-Fa Chen | 2025-01-28 |