Issued Patents 2025
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431210 | Selecting read reference voltage using historical decoding information | Bo Fu, Zining Wu | 2025-09-30 |
| 12431917 | Systems and methods for decoding codewords | Chenrong Xiong, Han Zhang, Jianing Chen, Yanfang Liu | 2025-09-30 |
| 12421341 | Suspension stabilizer with high yield value and high transparency, and preparation process and use thereof | Shuliang Rao | 2025-09-23 |
| 12412882 | Buffer design for package integration | Hsien-Wei Chen, Ming-Fa Chen, Chen-Hua Yu | 2025-09-09 |
| 12399257 | Lidar and detection apparatus thereof | Linsen Ding, Yongji Mu, Shaoqing Xiang | 2025-08-26 |
| 12399821 | Valid data retrieval for garbage collection | Bo Fu | 2025-08-26 |
| 12399651 | Method for instruction transmission for memory devices and storage system | Tao Wei, Moyang Chen | 2025-08-26 |
| 12394742 | Interconnect structure for high power GaN module including a printed planar interconnect line and method for making the same | Yong Xie, Rajen Manicon Murugan, Woochan Kim | 2025-08-19 |
| 12394758 | Packages with metal line crack prevention design | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen | 2025-08-19 |
| 12394772 | Molded dies in semiconductor packages and methods of forming same | Hsien-Wei Chen, Ming-Fa Chen | 2025-08-19 |
| 12368115 | Supporting InFO packages to reduce warpage | Ying-Ju Chen, Hsien-Wei Chen | 2025-07-22 |
| 12362342 | Semiconductor package | Hsien-Wei Chen, Ming-Fa Chen | 2025-07-15 |
| 12362178 | Method for fabricating a chip package | Hsien-Wei Chen, Tzuan-Horng Liu, Ying-Ju Chen | 2025-07-15 |
| 12355255 | Inverter, power grid power supply system, and method for controlling excitation inrush current | Mingxuan Dong, Shuo Wang, Wenchao Li, Mingquan ZHAO, Kai Xin | 2025-07-08 |
| 12351734 | Bitumen cutback compositions and methods of use thereof | Wallace James Rae, John Matthews, Nargess Puladian, Lijin Kuriachan | 2025-07-08 |
| 12346558 | Non-volatile memory with an arbitration function on shared status channel | Gang Zhao, Wei Jiang, Lin Chen | 2025-07-01 |
| 12328443 | Encoding and decoding method and device for determining a decoding order between a left and a right lower blocks | Yin-ji Piao, Elena Alshina | 2025-06-10 |
| 12317655 | Semiconductor package and manufacturing method of semiconductor package | Ming-Fa Chen, Hsien-Wei Chen | 2025-05-27 |
| 12308298 | Semiconductor die, manufacturing method thereof, and semiconductor package | Hsien-Wei Chen, Ming-Fa Chen | 2025-05-20 |
| 12288802 | Structure and method for forming integrated high density MIM capacitor | Hsien-Wei Chen, Ying-Ju Chen, Ming-Fa Chen | 2025-04-29 |
| 12283543 | Semiconductor packages | Hsien-Wei Chen, Ming-Fa Chen | 2025-04-22 |
| 12276753 | Optical transceiving module and laser radar | Shaoqing Xiang | 2025-04-15 |
| 12272678 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen | 2025-04-08 |
| 12271554 | Touch circuit, driving method, and touch display panel | Dongmei Wei, Zhonglin CAO, Yajuan Feng, Yao LI, Haijiang Yuan | 2025-04-08 |
| 12266637 | Die stack structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh, Ying-Ju Chen | 2025-04-01 |