Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412840 | Power module with multi-layer substrate and second insulation layer to increase power density | Kwnag-Soo Kim, Vivek Kishorechand Arora | 2025-09-09 |
| 12413332 | Method and apparatus for transmitting and receiving data in wireless communication system supporting full-duplex radio | Dongsoo Shin | 2025-09-09 |
| 12400939 | Packaged semiconductor device including heat slug | Ken Pham, Vivek Kishorechand Arora | 2025-08-26 |
| 12394742 | Interconnect structure for high power GaN module including a printed planar interconnect line and method for making the same | Jie Chen, Yong Xie, Rajen Manicon Murugan | 2025-08-19 |
| 12363644 | Wireless communication system supporting full duplex radio, and apparatus therefor | Daegeun KANG, Jongpil Lee | 2025-07-15 |
| 12347742 | IC package with heat spreader | Rongwei Zhang, Patrick Francis Thompson | 2025-07-01 |
| 12250568 | Method and apparatus for reducing interference effects in wireless communication systems | Yonghak Suh | 2025-03-11 |