Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412840 | Power module with multi-layer substrate and second insulation layer to increase power density | Kwnag-Soo Kim, Woochan Kim | 2025-09-09 |
| 12400939 | Packaged semiconductor device including heat slug | Ken Pham, Woochan Kim | 2025-08-26 |