Issued Patents 2025
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261163 | Molded dies in semiconductor packages and methods of forming same | Hsien-Wei Chen, Ming-Fa Chen | 2025-03-25 |
| 12253861 | Multi-machining robot collaboration method in flexible hardware production workshop | Bin Xin, Sai Lu, Lihua DOU, Qing Wang, Miao Wang | 2025-03-18 |
| 12249142 | Method and an electronic apparatus for acquiring a floor map of a room layout | Juan Liu, Huasin Wang, Sukun YOON, Longhai WU | 2025-03-11 |
| 12243849 | Passives to facilitate mold compound flow | Chittranjan Mohan Gupta, Yiqi Tang, Rajen Manicon Murugan, Tianyi Luo | 2025-03-04 |
| 12224257 | Semiconductor structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen | 2025-02-11 |
| 12218105 | Package and method of forming the same | Hsien-Wei Chen, Ming-Fa Chen | 2025-02-04 |
| 12218108 | Package and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2025-02-04 |
| 12217143 | Resolving opaqueness of complex machine learning applications | Vijayan Nair, Agus Sudjianto, Kurt Schieding, Linwei Hu, Xiaoyu Liu +1 more | 2025-02-04 |
| 12211800 | Semiconductor package with shunt and patterned metal trace | Yiqi Tang, Rajen Manicon Murugan, Liang Wan, Makarand Ramkrishna Kulkarni, Steven Kummerl | 2025-01-28 |
| 12212738 | Encoding method and device therefor, and decoding method and device therefor | Yin-ji Piao, Chan-yul Kim | 2025-01-28 |
| 12205856 | Semiconductor structure including interconnection to probe pad with probe mark | Hsien-Wei Chen, Ching-Jung Yang | 2025-01-21 |
| 12205911 | Bonding structure and method of forming same | Ming-Fa Chen, Sung-Feng Yeh, Hsien-Wei Chen | 2025-01-21 |
| 12191259 | Multi-channel gate driver package with grounded shield metal | Yiqi Tang, Rajen Manicon Murugan | 2025-01-07 |
| 12191283 | Manufacturing method of three-dimensional stacking structure | Hsien-Wei Chen, Ming-Fa Chen | 2025-01-07 |