Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406915 | Plated metal layer in power packages | Jonathan Almeria Noquil, Osvaldo Jorge Lopez, Yiqi Tang, Rajen Manicon Murugan, Liang Wan | 2025-09-02 |
| 12322856 | Antenna in package having antenna on package substrate | Yiqi Tang, Liang Wan, Rajen Manicon Murugan | 2025-06-03 |
| 12211800 | Semiconductor package with shunt and patterned metal trace | Yiqi Tang, Rajen Manicon Murugan, Liang Wan, Jie Chen, Steven Kummerl | 2025-01-28 |