Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412841 | Semiconductor package and manufacturing method thereof | Chen-Hsuan Tsai, Szu-Wei Lu, Tsung-Fu Tsai | 2025-09-09 |
| 12327819 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2025-06-10 |
| 12255079 | Semiconductor package and method of manufacturing the same | Szu-Wei Lu, Chen-Hua Yu | 2025-03-18 |
| 12255155 | Package structure with stacked semiconductor dies | Yi-Chao Mao, Szu-Wei Lu | 2025-03-18 |