Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278199 | Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applications | Tung-Liang Shao, Hsien-Ming Tu, Ching-Jung Yang, Yu-Chia Lai | 2025-04-15 |