Issued Patents 2025
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406941 | Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same | Yi-Che Chiang, Chien-Hsun Chen, Tuan-Yu Hung, Hsin-Yu Pan, Wei-Kang Hsieh +8 more | 2025-09-02 |
| 12374627 | Method of fabricating semiconductor structure | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2025-07-29 |
| 12362283 | Semiconductor device and method of manufacturing the same | Cheng-Chieh Hsieh, Hao-Yi Tsai | 2025-07-15 |
| 12362329 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang +4 more | 2025-07-15 |
| 12322696 | Dual-mode wireless charging device | Shih-Wei Liang, Hung-Yi Kuo, Hao-Yi Tsai, Hsien-Ming Tu | 2025-06-03 |
| 12288729 | Integrated circuit package and method | Tzu-Sung Huang, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu +2 more | 2025-04-29 |
| 12266639 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang +4 more | 2025-04-01 |
| 12261092 | Semiconductor package and manufacturing method thereof | Tzu-Sung Huang, Yen-Liang Lin, Ban-Li Wu, Hsiu-Jen Lin, Teng-Yuan Lo +1 more | 2025-03-25 |
| 12255184 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Yen-Liang Lin, Tzu-Sung Huang, Tin-Hao Kuo, Hao-Yi Tsai | 2025-03-18 |