Issued Patents 2025
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374627 | Method of fabricating semiconductor structure | Tzu-Sung Huang, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2025-07-29 |
| 12368141 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2025-07-22 |
| 12360321 | Package structure, semiconductor device and method of fabricating the same | Chung-Ming Weng, Hao-Yi Tsai, Hung-Yi Kuo, Tsung-Yuan Yu, Yu-Hao Chen | 2025-07-15 |
| 12362283 | Semiconductor device and method of manufacturing the same | Ming Hung Tseng, Hao-Yi Tsai | 2025-07-15 |
| 12362329 | Method of fabricating semiconductor package | Hao-Yi Tsai, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2025-07-15 |
| 12315784 | Semiconductor package and manufacturing method thereof | Hung-Yi Kuo, Kuo-Chung Yee, Chen-Hua Yu | 2025-05-27 |
| 12266639 | Method of fabricating semiconductor package | Hao-Yi Tsai, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2025-04-01 |
| 12222545 | Package and method of forming same | Chih-Hsuan Tai, Chung-Ming Weng, Hung-Yi Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2025-02-11 |
| 12210188 | Semiconductor package and manufacturing method thereof | Hung-Yi Kuo, Chen-Hua Yu, Che-Hsiang Hsu, Chung-Ming Weng, Tsung-Yuan Yu | 2025-01-28 |
| 12210200 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo +3 more | 2025-01-28 |