Issued Patents 2025
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431366 | Structure having thermal dissipation structure therein and manufacturing method thereof | Chen-Hua Yu, Yian-Liang Kuo | 2025-09-30 |
| 12374602 | Semiconductor structure having through substrate via and manufacturing method thereof | Wei-Ming Wang, Yu-Hung Lin, Yu-Hsiao Lin, Shih-Peng Tai | 2025-07-29 |
| 12362262 | Semiconductor device including through die via | Chen-Hua Yu | 2025-07-15 |
| 12347785 | Semiconductor structure and method manufacturing the same | Chen-Hua Yu | 2025-07-01 |
| 12341079 | Package structure and manufacturing method thereof | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung | 2025-06-24 |
| 12315831 | Package structure and manufacturing method thereof | Chen-Hua Yu | 2025-05-27 |
| 12315784 | Semiconductor package and manufacturing method thereof | Hung-Yi Kuo, Cheng-Chieh Hsieh, Chen-Hua Yu | 2025-05-27 |
| 12300646 | Chiplets 3D SoIC system integration and fabrication methods | Chen-Hua Yu | 2025-05-13 |
| 12293991 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Chih-Hang Tung | 2025-05-06 |
| 12283556 | Package structure | Chen-Hua Yu, Chun-Hui Yu | 2025-04-22 |
| 12272613 | Thermal structure for semiconductor device and method of forming the same | Wei-Ming Wang, Yu-Hung Lin, Shih-Peng Tai | 2025-04-08 |
| 12261142 | Semiconductor structure including thermal enhanced bonding structure | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Po-Fan Lin | 2025-03-25 |
| 12238865 | Integrated circuit structure | Chen-Hua Yu, Jui-Pin Hung | 2025-02-25 |
| 12224276 | 3D semiconductor packages | Chen-Hua Yu, Chun-Hui Yu, Liang-Ju Yen | 2025-02-11 |
| 12218089 | Packaged semiconductor device and method of forming thereof | Chen-Hua Yu, Chih-Hang Tung | 2025-02-04 |
| 12209015 | MEMS packages and methods of manufacture thereof | Chen-Hua Yu | 2025-01-28 |
| 12199065 | Multi-die package structures including redistribution layers | Chen-Hua Yu, Tsung-Ding Wang, Chien-Hsun Lee | 2025-01-14 |
| 12191279 | Integrated circuit packages and methods of forming the same | Chen-Hua Yu | 2025-01-07 |