Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431435 | Semiconductor packages and methods of forming the same | Cheng-Yen Hsieh, Ping-Kang Huang, Sao-Ling Chiu, Yi-Jhang Wang | 2025-09-30 |
| 12341079 | Package structure and manufacturing method thereof | Chen-Hua Yu, Jeng-Nan Hung, Kuo-Chung Yee | 2025-06-24 |
| 12283556 | Package structure | Chen-Hua Yu, Kuo-Chung Yee | 2025-04-22 |
| 12261142 | Semiconductor structure including thermal enhanced bonding structure | Chen-Hua Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2025-03-25 |
| 12224276 | 3D semiconductor packages | Chen-Hua Yu, Kuo-Chung Yee, Liang-Ju Yen | 2025-02-11 |