Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431435 | Semiconductor packages and methods of forming the same | Chun-Hui Yu, Ping-Kang Huang, Sao-Ling Chiu, Yi-Jhang Wang | 2025-09-30 |
| 12374599 | Package structure comprising a semiconductor die with thermoelectric elements and manufacturing method thereof | Chih-Horng Chang, Chung-Yu Lu | 2025-07-29 |