Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
CC

Chih-Horng Chang

TSMC: 1 patents #2,025 of 3,957Top 55%
Overall (2025): #430,132 of 469,880Top 95%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12374599 Package structure comprising a semiconductor die with thermoelectric elements and manufacturing method thereof Cheng-Yen Hsieh, Chung-Yu Lu 2025-07-29