Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341079 | Package structure and manufacturing method thereof | Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee | 2025-06-24 |
| 12261142 | Semiconductor structure including thermal enhanced bonding structure | Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee, Po-Fan Lin | 2025-03-25 |