Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374596 | Semiconductor package and manufacturing method thereof | Wei-Ming Wang, Yu-Hung Lin | 2025-07-29 |
| 12374602 | Semiconductor structure having through substrate via and manufacturing method thereof | Wei-Ming Wang, Yu-Hung Lin, Yu-Hsiao Lin, Kuo-Chung Yee | 2025-07-29 |
| 12347801 | Semiconductor package and method for manufacturing the same | Po-Han Wang, Hung-Jui Kuo, Yu-Hsiang Hu, I-Chia Chen | 2025-07-01 |
| 12272613 | Thermal structure for semiconductor device and method of forming the same | Wei-Ming Wang, Yu-Hung Lin, Kuo-Chung Yee | 2025-04-08 |