Issued Patents 2025
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418982 | Laminated structure with pads and manufacturing method thereof | Hao-Cheng Hou, Tsung-Ding Wang, Jung Wei Cheng, Chien-Hsun Chen | 2025-09-16 |
| 12394696 | Package structure including an array of copper pillars and methods of forming the same | Wei-Yu Chen, Collin Jordon Fleshman | 2025-08-19 |
| 12368112 | Electronic component and manufacturing method thereof | Chi-Yang Yu, Jung Wei Cheng, Yu-Min Liang | 2025-07-22 |
| 12362228 | Semiconductor package and method | Chen-Hua Yu, Wei-Yu Chen, Jiun Yi Wu, Chung-Shi Liu | 2025-07-15 |
| 12362321 | Semiconductor package | Tsung-Ding Wang, Yen-Fu Su, Hao-Cheng Hou, Jung Wei Cheng, Hsin-Yu Pan | 2025-07-15 |
| 12354969 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2025-07-08 |
| 12356558 | Electronic assembly having circuit carrier | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2025-07-08 |
| 12354924 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Jiun Yi Wu, Chung-Shi Liu | 2025-07-08 |
| 12345740 | Probe card substrate, substrate structure and method of fabricating the same | Wei-Yu Chen, Yu-Min Liang, Hao-Cheng Hou, Tsung-Ding Wang, Chung-Shi Liu +1 more | 2025-07-01 |
| 12272855 | Semiconductor device and methods, where first and second transmission lines are surrounded by first and second high-k dielectric materials | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2025-04-08 |
| 12245361 | Interconnect structure having conductor extending along dielectric block | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2025-03-04 |
| 12199065 | Multi-die package structures including redistribution layers | Chen-Hua Yu, Kuo-Chung Yee, Tsung-Ding Wang | 2025-01-14 |
| 12199080 | Electronics card including multi-chip module | Chen-Hua Yu, Jiun Yi Wu | 2025-01-14 |
| 12193168 | Circuit board and semiconductor device including the same | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2025-01-07 |