Issued Patents 2025
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424571 | Package structure and manufacturing method thereof | Sen-Kuei Hsu | 2025-09-23 |
| 12418005 | Semiconductor package and manufacturing method thereof | Tzuan-Horng Liu, Hao-Yi Tsai, Kris Lipu Chuang | 2025-09-16 |
| 12406941 | Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same | Yi-Che Chiang, Chien-Hsun Chen, Tuan-Yu Hung, Wei-Kang Hsieh, Tsung-Hsien Chiang +8 more | 2025-09-02 |
| 12400936 | Stacked memory cube with integrated thermal path for enhanced heat dissipation | Lipu Kris Chuang, Chung-Shi Liu, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko | 2025-08-26 |
| 12388041 | Semiconductor package | Kris Lipu Chuang, Hsiu-Jen Lin, Tzu-Sung Huang | 2025-08-12 |
| 12362270 | Package structure and method of fabricating the same | Kris Lipu Chuang, Tzu-Sung Huang, Chih-Wei Lin, Yu-Fu Chen, Hao-Yi Tsai | 2025-07-15 |
| 12362275 | Method of fabricating package structure including a plurality of antenna patterns | Sen-Kuei Hsu, Yi-Che Chiang | 2025-07-15 |
| 12362321 | Semiconductor package | Tsung-Ding Wang, Yen-Fu Su, Hao-Cheng Hou, Jung Wei Cheng, Chien-Hsun Lee | 2025-07-15 |
| 12279064 | Image compensation circuit for gamma calibration | Wei-Jhe Ma, Feng-Ting Pai, Jun Yang | 2025-04-15 |
| 12266648 | Package structure | Sen-Kuei Hsu, Ming-Hsien Tsai | 2025-04-01 |
| 12255196 | Semiconductor package with thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Chih-Hua Chen, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2025-03-18 |
| 12230589 | Semiconductor package | Chi-Yang Yu, Jung Wei Cheng, Yu-Min Liang, Jiun Yi Wu, Yen-Fu Su +1 more | 2025-02-18 |
| 12218021 | Semiconductor packages and methods of forming the same | Jung Wei Cheng, Jiun Yi Wu, Tsung-Ding Wang, Yu-Min Liang, Wei-Yu Chen | 2025-02-04 |