Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400936 | Stacked memory cube with integrated thermal path for enhanced heat dissipation | Chung-Shi Liu, Han-Ping Pu, Hsin-Yu Pan, Ming-Kai Liu, Ting-Chu Ko | 2025-08-26 |
| 12255196 | Semiconductor package with thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Tin-Hao Kuo | 2025-03-18 |