Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431446 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2025-09-30 |
| 12394242 | Fingerprint sensor device and method | Yu-Chih Huang, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2025-08-19 |
| 12260669 | Fingerprint sensor in InFO structure and formation method | Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang | 2025-03-25 |
| 12255196 | Semiconductor package with thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2025-03-18 |