Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417968 | Package structure and forming method thereof | Chin-Liang Chen, Yu-Min Liang, Hao-Cheng Hou, Jung Wei Cheng, Tsung-Ding Wang | 2025-09-16 |
| 12412862 | Package structure and manufacturing method thereof | Nien-Fang Wu, Hai-Ming Chen, Yu-Min Liang, Jiun Yi Wu | 2025-09-09 |
| 12368112 | Electronic component and manufacturing method thereof | Jung Wei Cheng, Yu-Min Liang, Chien-Hsun Lee | 2025-07-22 |
| 12347802 | Die corner removal for underfill crack suppression in semiconductor die packaging | Wei-Yu Chen, Kuan-Lin Ho, Chin-Liang Chen, Yu-Min Liang, Jiun Yi Wu | 2025-07-01 |
| 12230589 | Semiconductor package | Jung Wei Cheng, Yu-Min Liang, Jiun Yi Wu, Yen-Fu Su, Chien-Chang Lin +1 more | 2025-02-18 |