Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417968 | Package structure and forming method thereof | Chi-Yang Yu, Yu-Min Liang, Hao-Cheng Hou, Jung Wei Cheng, Tsung-Ding Wang | 2025-09-16 |
| 12417969 | Semiconductor structure and circuit structure | Kuan-Lin Ho, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang, Jiun Yi Wu | 2025-09-16 |
| 12412846 | Semiconductor package and methods of fabricating a semiconductor package | Hao-Cheng Hou, Yu-Min Liang, Jung Wei Cheng, Tsung-Ding Wang | 2025-09-09 |
| 12347802 | Die corner removal for underfill crack suppression in semiconductor die packaging | Wei-Yu Chen, Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang, Jiun Yi Wu | 2025-07-01 |