Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417968 | Package structure and forming method thereof | Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang, Jung Wei Cheng, Tsung-Ding Wang | 2025-09-16 |
| 12418982 | Laminated structure with pads and manufacturing method thereof | Tsung-Ding Wang, Jung Wei Cheng, Chien-Hsun Chen, Chien-Hsun Lee | 2025-09-16 |
| 12412846 | Semiconductor package and methods of fabricating a semiconductor package | Chin-Liang Chen, Yu-Min Liang, Jung Wei Cheng, Tsung-Ding Wang | 2025-09-09 |
| 12362321 | Semiconductor package | Tsung-Ding Wang, Yen-Fu Su, Jung Wei Cheng, Chien-Hsun Lee, Hsin-Yu Pan | 2025-07-15 |
| 12345740 | Probe card substrate, substrate structure and method of fabricating the same | Wei-Yu Chen, Yu-Min Liang, Tsung-Ding Wang, Chien-Hsun Lee, Chung-Shi Liu +1 more | 2025-07-01 |