Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424562 | Three-dimensional (3D) package | Wei-Yu Chen, Chun-Chih Chuang, Yu-Min Liang, Jiun Yi Wu | 2025-09-23 |
| 12417969 | Semiconductor structure and circuit structure | Chin-Liang Chen, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang, Jiun Yi Wu | 2025-09-16 |
| 12347802 | Die corner removal for underfill crack suppression in semiconductor die packaging | Wei-Yu Chen, Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang, Jiun Yi Wu | 2025-07-01 |