Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
CC

Chun-Chih Chuang

Applied Materials: 1 patents #536 of 1,465Top 40%
TSMC: 1 patents #2,025 of 3,957Top 55%
Overall (2025): #136,128 of 469,880Top 30%
2
Patents 2025

Issued Patents 2025

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
12424562 Three-dimensional (3D) package Wei-Yu Chen, Kuan-Lin Ho, Yu-Min Liang, Jiun Yi Wu 2025-09-23
12189299 Digital lithography scan sequencing Ying-Chiao Wang, Thomas Laidig, Frederick Lie, Chen-Yuan Hsieh, Chun-Cheng Yeh 2025-01-07