Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406941 | Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same | Chien-Hsun Chen, Tuan-Yu Hung, Hsin-Yu Pan, Wei-Kang Hsieh, Tsung-Hsien Chiang +8 more | 2025-09-02 |
| 12362275 | Method of fabricating package structure including a plurality of antenna patterns | Sen-Kuei Hsu, Hsin-Yu Pan | 2025-07-15 |