Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406941 | Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same | Yi-Che Chiang, Chien-Hsun Chen, Tuan-Yu Hung, Hsin-Yu Pan, Tsung-Hsien Chiang +8 more | 2025-09-02 |
| 12374592 | Semiconductor device and manufacturing method thereof | Cheng-Chieh Wu, Ting Hao Kuo, Kuo Lung Pan, Po-Yuan Teng, Yu-Chia Lai +7 more | 2025-07-29 |