Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272855 | Semiconductor device and methods, where first and second transmission lines are surrounded by first and second high-k dielectric materials | Jiun Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou | 2025-04-08 |
| 12245361 | Interconnect structure having conductor extending along dielectric block | Jiun Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou | 2025-03-04 |