Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431400 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Tai-Min Chang, De-Yuan Lu, Ming-Tan Lee | 2025-09-30 |
| 12381176 | Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer | Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2025-08-05 |
| 12374627 | Method of fabricating semiconductor structure | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2025-07-29 |
| 12362309 | Package structure | Hung-Jui Kuo, Jyun-Siang Peng | 2025-07-15 |
| 12315819 | Method of forming RDLs and structure formed thereof | Hung-Jui Kuo, Yun Chen Hsieh, Chen-Hua Yu | 2025-05-27 |
| 12302677 | Semiconductor device and method | Chen-Hua Yu, Keng-Han Lin, Hung-Jui Kuo | 2025-05-13 |