Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431400 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Hui-Jung Tsai, De-Yuan Lu, Ming-Tan Lee | 2025-09-30 |
| 12381176 | Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2025-08-05 |