Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381176 | Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer | Hui-Jung Tsai, Yun Chen Hsieh, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2025-08-05 |
| 12362309 | Package structure | Hui-Jung Tsai, Hung-Jui Kuo | 2025-07-15 |