Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381176 | Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer | Hui-Jung Tsai, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2025-08-05 |
| 12315819 | Method of forming RDLs and structure formed thereof | Hung-Jui Kuo, Chen-Hua Yu, Hui-Jung Tsai | 2025-05-27 |