Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431400 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Tai-Min Chang, Hui-Jung Tsai, De-Yuan Lu | 2025-09-30 |
| 12353134 | Photoresist system and method | Hung-Jui Kuo, De-Yuan Lu, Chen-Hua Yu | 2025-07-08 |
| 12197138 | Machine learning on overlay management | Tzu-Cheng Lin, Chien Rhone Wang, Kewei Zuo, Zi-Jheng Liu | 2025-01-14 |