Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431400 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Tai-Min Chang, Hui-Jung Tsai, Ming-Tan Lee | 2025-09-30 |
| 12353134 | Photoresist system and method | Hung-Jui Kuo, Chen-Hua Yu, Ming-Tan Lee | 2025-07-08 |