Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12345935 | Package assembly and manufacturing method thereof | Chih-Chieh Chang, Chen-Hua Yu, Chuei-Tang Wang | 2025-07-01 |
| 12341106 | Package structure | Chun-Wen Lin, Chen-Hua Yu, Chuei-Tang Wang, Che-Wei Hsu | 2025-06-24 |
| 12327796 | Architecture for computing system package | Chen-Hua Yu, Chieh-Yen Chen, Chuei-Tang Wang | 2025-06-10 |
| 12266673 | Semiconductor package and method of forming the same | Chia-Lun Chang, Ching-Hua Hsieh, Chung-Shi Liu, Chuei-Tang Wang, Hsiu-Jen Lin | 2025-04-01 |