Issued Patents 2025
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424730 | Antenna package for signal transmission | Wen-Shiang Liao | 2025-09-23 |
| 12379556 | Package structure having grating coupler and manufacturing method thereof | Chewn-Pu Jou, Hsing-Kuo Hsia, Chih-Wei Tseng | 2025-08-05 |
| 12306436 | Thermally tunable waveguide and photonic integrated circuit component having the same | Wen-Shiang Liao | 2025-05-20 |
| 12298565 | Optical device for coupling light and method for fabricating the same | Chan-Hong Chern, Chih-Chang Lin, Chewn-Pu Jou, Chih-Tsung Shih, Lan-Chou Cho +2 more | 2025-05-13 |
| 12293974 | Photonics integrated circuit package | Chewn-Pu Jou, Shuo-Mao Chen | 2025-05-06 |
| 12293141 | Integrated circuit stack verification method and system for performing the same | Shuo-Mao Chen, Chin-Yuan Huang, Kai-Yun Lin, Ho-Hsiang Chen, Chewn-Pu Jou | 2025-05-06 |
| 12293954 | Method of fabricating semiconductor structure with heating element | Chih-Tsung Shih, Chewn-Pu Jou, Stefan Rusu | 2025-05-06 |
| 12288021 | Apparatus and method for generating a parameterized waveguide optical elements | Wen-Shiang Liao | 2025-04-29 |
| 12276836 | Optical waveguide apparatus and method of fabrication thereof | Chan-Hong Chern, Chih-Chang Lin, Min-Hsiang Hsu, Weiwei Song, Chewn-Pu Jou +2 more | 2025-04-15 |
| 12278259 | Systems and methods for shielded inductive devices | Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, Robert Bogdan Staszewski | 2025-04-15 |
| 12272637 | Integrated fan-out package with 3D magnetic core inductor | Wen-Shiang Liao, Chih-Hang Tung, Chen-Hua Yu, Chewn-Pu Jou | 2025-04-08 |
| 12243860 | Package structure, semiconductor device comprising grating coupler and reflector structure embedded in the dielectric layer | Chewn-Pu Jou | 2025-03-04 |
| 12222554 | Fiber-to-chip grating coupler for photonic circuits | Lan-Chou Cho, Huan-Neng Chen, Chewn-Pu Jou | 2025-02-11 |
| 12191265 | Antenna apparatus and method | Wen-Shiang Liao | 2025-01-07 |