Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205861 | Manufacturing method of semiconductor package including forming cavity in circuit substrate without exposing floor plate | Meng-Liang Lin, Po-Yao Chuang, Shuo-Mao Chen, Shin-Puu Jeng | 2025-01-21 |