Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424586 | Bridging-resistant microbump structures and methods of forming the same | Yen-Hao Chen, Chien-Sheng Chen, Shin-Puu Jeng | 2025-09-23 |
| 12381180 | Multi-chip packages and methods of forming the same | Shuo-Mao Chen, Feng-Cheng Hsu, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2025-08-05 |
| 12362299 | Basin-shaped underbump plates and methods of forming the same | Yen-Hao Chen, Yu-Sheng Lin, Chien-Sheng Chen, Shin-Puu Jeng | 2025-07-15 |