Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381180 | Multi-chip packages and methods of forming the same | Shuo-Mao Chen, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2025-08-05 |
| 12362276 | Semiconductor package having a semiconductor device bonded to a circuit substrate through a floated or grounded dummy conductor and method of manufacturing the same | Shin-Puu Jeng | 2025-07-15 |
| 12322742 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Chao-Hsiang Yang, Shin-Puu Jeng +4 more | 2025-06-03 |
| 12278156 | Semiconductor package | Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng, Wen-Yi Lin, Shu-Shen Yeh | 2025-04-15 |
| 12249550 | Semiconductor package and method manufacturing the same | Shin-Puu Jeng | 2025-03-11 |
| 12243800 | Package structure with lid and method for forming the same | Shin-Puu Jeng, Po-Yao Lin, Shuo-Mao Chen, Chin-Hua Wang | 2025-03-04 |
| 12218095 | Chip package structure having molding layer | Shin-Puu Jeng, Shuo-Mao Chen | 2025-02-04 |