HL

Hsien-Wen Liu

TSMC: 4 patents #764 of 3,957Top 20%
SE Sercomm: 1 patents #1 of 11Top 10%
Overall (2025): #23,807 of 469,880Top 6%
5
Patents 2025

Issued Patents 2025

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
12381180 Multi-chip packages and methods of forming the same Shuo-Mao Chen, Feng-Cheng Hsu, Han-Hsiang Huang, Shin-Puu Jeng, Hsiao-Wen Lee 2025-08-05
12382587 Methods and systems for improving surface mount joinder Shih-Ting Hung, Jyun-Lin Wu, Yao-Chun Chuang, Yinlung Lu 2025-08-05
12334654 Network communication device with antenna frame Chih-Wen Tseng 2025-06-17
12205853 Integrated circuit test method and structure thereof Hsien-Wei Chen 2025-01-21
12198996 Integrated fan-out package, package-on-package structure, and manufacturing method thereof Shin-Puu Jeng, Shih-Ting Hung, Yi-Jou Lin, Tzu-Jui Fang, Po-Yao Chuang 2025-01-14