Issued Patents 2025
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424558 | Bridge die having different surface orientation than IC dies interconnected by the bridge die | Yu-Sheng Lin, Chin-Fu Kao, Tsung-Yang Hsieh, Jyun-Lin Wu | 2025-09-23 |
| 12388047 | Integrated fan-out platform and manufacturing method for semiconductor devices | Li-Hsien Huang, Hsueh-Lung Cheng, Yinlung Lu | 2025-08-12 |
| 12382587 | Methods and systems for improving surface mount joinder | Hsien-Wen Liu, Shih-Ting Hung, Jyun-Lin Wu, Yinlung Lu | 2025-08-05 |
| 12362246 | Interposer including stepped surfaces and methods of forming the same | Yu-Sheng Lin, Hsin-Hsien Lee, Jyun-Lin Wu | 2025-07-15 |
| 12362307 | Semiconductor package with ball grid array connection having improved reliability | Yu-Sheng Lin, Chen-Nan Chiu, Jyun-Lin Wu | 2025-07-15 |
| 12354946 | Delamination control of dielectric layers of integrated circuit chips | Jun He, Li-Hsien Huang, Chih-Lin Wang, Shih-Kang Tien | 2025-07-08 |
| 12354975 | Guard ring structure | Min-Feng Ku, Cheng-Chien Li, Ching-Pin Lin | 2025-07-08 |
| 12334465 | Semiconductor package and method of forming same | Li-Hsien Huang, SyuFong Li, Ching-Pin Lin, Jun He | 2025-06-17 |
| 12322716 | Heat dissipating features for laser drilling process | Chien-Hung Chen, Cheng-Pu Chiu, Chien-Chen Li, Chien-Li Kuo, Ting-Ting Kuo +2 more | 2025-06-03 |
| 12288735 | Through via structure | Min-Feng Ku, Cheng-Chien Li, Ching-Pin Lin | 2025-04-29 |