Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424558 | Bridge die having different surface orientation than IC dies interconnected by the bridge die | Yu-Sheng Lin, Chin-Fu Kao, Jyun-Lin Wu, Yao-Chun Chuang | 2025-09-23 |
| 12261133 | Interposer with warpage-relief trenches | Chien-Chang Lee, Chia-Ping Lai, Wen-Chung Lu, Cheng-Kang Huang, Mei-Shih Kuo +1 more | 2025-03-25 |