Issued Patents 2025
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431467 | Fan-out packages providing enhanced mechanical strength and methods for forming the same | Jen-Yuan Chang | 2025-09-30 |
| 12417987 | Semiconductor die including guard ring structure and three-dimensional device structure including the same | Jen-Yuan Chang, Chien-Chang Lee | 2025-09-16 |
| 12379557 | Semiconductor structure and method for forming the same | Jen-Yuan Chang | 2025-08-05 |
| 12369420 | Methods for forming image sensors | Chiao-Chi Wang, Chung-Chuan Tseng, Szu-Chien Tseng, Yeh-Hsun Fang | 2025-07-22 |
| 12362323 | Three-dimensional integrated circuit | Jen-Yuan Chang, Chien-Chang Lee | 2025-07-15 |
| 12364028 | Image sensor device and methods of forming the same | Yeh-Hsun Fang, Chiao-Chi Wang, Chung-Chuan Tseng | 2025-07-15 |
| 12353034 | Optical integrated circuit structure including edge coupling protective features and method of forming same | Chen-Hao Huang, Sui-Ying Hsu, Yuehying Lee, Chien-Ying Wu, Hau-Yan Lu | 2025-07-08 |
| 12334487 | Method for forming a semiconductor die and a photoelectric device integrated in a same package | Jen-Yuan Chang | 2025-06-17 |
| 12322679 | Semiconductor die including through substrate via barrier structure and methods for forming the same | Jen-Yuan Chang, Shih-Chang Chen, Tzu-Chung Tsai, Chien-Chang Lee | 2025-06-03 |
| 12278167 | Semiconductor die including through substrate via barrier structure and methods for forming the same | Jen-Yuan Chang, Shih-Chang Chen, Tzu-Chung Tsai, Chien-Chang Lee | 2025-04-15 |
| 12272724 | Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same | Jen-Yuan Chang, Chien-Chang Lee, Tzu-Chung Tsai | 2025-04-08 |
| 12261133 | Interposer with warpage-relief trenches | Tsung-Yang Hsieh, Chien-Chang Lee, Wen-Chung Lu, Cheng-Kang Huang, Mei-Shih Kuo +1 more | 2025-03-25 |
| 12230613 | Vertical semiconductor package including horizontally stacked dies and methods of forming the same | Jen-Yuan Chang | 2025-02-18 |
| 12230607 | Semiconductor device including power management die in a stack and methods of forming the same | Jen-Yuan Chang | 2025-02-18 |
| 12224268 | Fan-out packages providing enhanced mechanical strength and methods for forming the same | Jen-Yuan Chang | 2025-02-11 |
| 12218049 | Semiconductor structure and method for forming the same | Jen-Yuan Chang | 2025-02-04 |
| 12211838 | Device including MIM capacitor and resistor | Chen-Hsiang Hung, Li-Hsin Chu, Chung-Chuan Tseng | 2025-01-28 |