Issued Patents 2025
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431467 | Fan-out packages providing enhanced mechanical strength and methods for forming the same | Chia-Ping Lai | 2025-09-30 |
| 12431444 | Package structure having trench capacitor | Fu-Chiang Kuo | 2025-09-30 |
| 12417987 | Semiconductor die including guard ring structure and three-dimensional device structure including the same | Chien-Chang Lee, Chia-Ping Lai | 2025-09-16 |
| 12412798 | Semiconductor device and method of forming | — | 2025-09-09 |
| 12400994 | Semiconductor placing in packaging | — | 2025-08-26 |
| 12400926 | Semiconductor device and method of manufacture | You-Ru Lin, Sheng Kai YEH, Chi-Yuan Shih, Chia-Ming Hung, Hsiang-Fu Chen +1 more | 2025-08-26 |
| 12394643 | Apparatus for manufacturing a bonded semiconductor structure and method for manufacturing the same | — | 2025-08-19 |
| 12379557 | Semiconductor structure and method for forming the same | Chia-Ping Lai | 2025-08-05 |
| 12381165 | Semiconductor structure and method of manufacturing the same | — | 2025-08-05 |
| 12381181 | Semiconductor device including a plurality of dielectric materials between semiconductor dies and methods of forming the same | Tzu-Chung Tsai | 2025-08-05 |
| 12362323 | Three-dimensional integrated circuit | Chia-Ping Lai, Chien-Chang Lee | 2025-07-15 |
| 12364019 | Deep trench capacitor fuse structure for high voltage breakdown defense and methods for forming the same | — | 2025-07-15 |
| 12347792 | Dummy pattern structure for reducing dishing | — | 2025-07-01 |
| 12334487 | Method for forming a semiconductor die and a photoelectric device integrated in a same package | Chia-Ping Lai | 2025-06-17 |
| 12327825 | Package structure and method of forming thereof | Sheng-Chih WANG | 2025-06-10 |
| 12322679 | Semiconductor die including through substrate via barrier structure and methods for forming the same | Chia-Ping Lai, Shih-Chang Chen, Tzu-Chung Tsai, Chien-Chang Lee | 2025-06-03 |
| 12311227 | Magnetic actuator and rehabilitation device having the same | Li-Wei Cheng, Zhi Chen | 2025-05-27 |
| 12308344 | Multi-chip package having stress relief structure | — | 2025-05-20 |
| 12300660 | Method of forming a bonded semiconductor structure | — | 2025-05-13 |
| 12283531 | Stacked semiconductor device test circuits and methods of use | — | 2025-04-22 |
| 12278167 | Semiconductor die including through substrate via barrier structure and methods for forming the same | Chia-Ping Lai, Shih-Chang Chen, Tzu-Chung Tsai, Chien-Chang Lee | 2025-04-15 |
| 12272670 | Integrated semiconductor packaging system with enhanced dielectric-to-dielectric bonding quality | — | 2025-04-08 |
| 12272724 | Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same | Chien-Chang Lee, Chia-Ping Lai, Tzu-Chung Tsai | 2025-04-08 |
| 12266634 | Vertically mounted die groups | — | 2025-04-01 |
| 12257726 | Robot and robot hand-eye calibrating method | Chun-Tse Lee | 2025-03-25 |