Issued Patents 2025
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261199 | Thermoelectric cooling of semiconductor devices | Jheng-Hong Jiang, Chin-Chou Liu, Long Song Lin | 2025-03-25 |
| 12255112 | Test key and semiconductor die including the same | Tse-Pan Yang, Wei-Yang Lee, Kuo-Pei Lu | 2025-03-18 |
| 12249590 | Die-group package having a deep trench device | — | 2025-03-11 |
| 12249390 | Memory systems with vertical integration | Chieh Lee, Yi-Ching Liu, Chia-En Huang, Yih Wang | 2025-03-11 |
| 12243787 | Method of forming testing module and method for using the same | Kong-Beng Thei, Jung-Hui Kao | 2025-03-04 |
| 12237303 | Vertically mounted die groups | — | 2025-02-25 |
| 12237244 | High density through silicon conductive structures | — | 2025-02-25 |
| 12230613 | Vertical semiconductor package including horizontally stacked dies and methods of forming the same | Chia-Ping Lai | 2025-02-18 |
| 12230607 | Semiconductor device including power management die in a stack and methods of forming the same | Chia-Ping Lai | 2025-02-18 |
| 12224268 | Fan-out packages providing enhanced mechanical strength and methods for forming the same | Chia-Ping Lai | 2025-02-11 |
| 12218049 | Semiconductor structure and method for forming the same | Chia-Ping Lai | 2025-02-04 |