Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417987 | Semiconductor die including guard ring structure and three-dimensional device structure including the same | Jen-Yuan Chang, Chia-Ping Lai | 2025-09-16 |
| 12362323 | Three-dimensional integrated circuit | Jen-Yuan Chang, Chia-Ping Lai | 2025-07-15 |
| 12322679 | Semiconductor die including through substrate via barrier structure and methods for forming the same | Jen-Yuan Chang, Chia-Ping Lai, Shih-Chang Chen, Tzu-Chung Tsai | 2025-06-03 |
| 12278167 | Semiconductor die including through substrate via barrier structure and methods for forming the same | Jen-Yuan Chang, Chia-Ping Lai, Shih-Chang Chen, Tzu-Chung Tsai | 2025-04-15 |
| 12272724 | Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same | Jen-Yuan Chang, Chia-Ping Lai, Tzu-Chung Tsai | 2025-04-08 |
| 12261133 | Interposer with warpage-relief trenches | Tsung-Yang Hsieh, Chia-Ping Lai, Wen-Chung Lu, Cheng-Kang Huang, Mei-Shih Kuo +1 more | 2025-03-25 |