Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424558 | Bridge die having different surface orientation than IC dies interconnected by the bridge die | Yu-Sheng Lin, Chin-Fu Kao, Tsung-Yang Hsieh, Yao-Chun Chuang | 2025-09-23 |
| 12382587 | Methods and systems for improving surface mount joinder | Hsien-Wen Liu, Shih-Ting Hung, Yao-Chun Chuang, Yinlung Lu | 2025-08-05 |
| 12362246 | Interposer including stepped surfaces and methods of forming the same | Yu-Sheng Lin, Hsin-Hsien Lee, Yao-Chun Chuang | 2025-07-15 |
| 12362307 | Semiconductor package with ball grid array connection having improved reliability | Yu-Sheng Lin, Chen-Nan Chiu, Yao-Chun Chuang | 2025-07-15 |