Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388028 | Package structure | Yi-Wen Wu, Shin-Puu Jeng, Po-Yao Chuang | 2025-08-12 |
| 12382587 | Methods and systems for improving surface mount joinder | Hsien-Wen Liu, Jyun-Lin Wu, Yao-Chun Chuang, Yinlung Lu | 2025-08-05 |
| 12320610 | Cover kit for firearm handguard | Shanyao Lee | 2025-06-03 |
| 12308313 | Semiconductor package with improved interposer structure | Yi-Wen Wu, Techi Wong, Po-Hao Tsai, Po-Yao Chuang, Shin-Puu Jeng | 2025-05-20 |
| 12237262 | Semiconductor package with improved interposer structure | Yi-Wen Wu, Techi Wong, Po-Hao Tsai, Po-Yao Chuang, Shin-Puu Jeng | 2025-02-25 |
| 12198996 | Integrated fan-out package, package-on-package structure, and manufacturing method thereof | Shin-Puu Jeng, Hsien-Wen Liu, Yi-Jou Lin, Tzu-Jui Fang, Po-Yao Chuang | 2025-01-14 |