Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308313 | Semiconductor package with improved interposer structure | Yi-Wen Wu, Po-Hao Tsai, Po-Yao Chuang, Shih-Ting Hung, Shin-Puu Jeng | 2025-05-20 |
| 12308322 | Dual-sided routing in 3D semiconductor system-in-package structure and methods of forming the same | Po-Hao Tsai, Po-Yao Chuang, Meng-Liang Lin, Yi-Wen Wu, Shin-Puu Jeng | 2025-05-20 |
| 12300592 | Fan-out package with controllable standoff | Po-Hao Tsai, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2025-05-13 |
| 12237262 | Semiconductor package with improved interposer structure | Yi-Wen Wu, Po-Hao Tsai, Po-Yao Chuang, Shih-Ting Hung, Shin-Puu Jeng | 2025-02-25 |
| 12199084 | Fan-out package with cavity substrate | Po-Hao Tsai, Po-Yao Chuang, Shin-Puu Jeng, Meng-Wei Chou, Meng-Liang Lin | 2025-01-14 |